BGA & Fine-Pitch Assembly
BGA assembly forms solder joints beneath the package, where a normal visual inspection cannot see them directly. Fine-pitch and bottom-terminated devices need a coordinated review of the footprint, board fabrication, stencil, placement and inspection approach.
Start with the component documentation
Use the actual component land-pattern and assembly guidance. Package name alone is not enough to set pad geometry, solder-mask definition or via treatment. Confirm how the fabricator and assembler will handle any vias inside pads.
Agree on inspection and acceptance
Discuss X-ray coverage, what the images can reveal and the acceptance criteria for the product. X-ray inspection does not by itself prove that a board functions correctly. Electrical and functional checks must be specified separately.
Plan rework before it is needed
Dense routing, nearby components, underfill and thermal sensitivity can affect rework. If rework is a project requirement, define the approved process, handling limits and verification after replacement.
What to include in your RFQ
- Manufacturer package and land-pattern guidance
- BGA pitch and any via-in-pad details
- Moisture sensitivity and handling information
- X-ray scope and acceptance criteria
- Electrical verification and rework requirements
Confirm the process limits, material availability and acceptance criteria in your project quotation. They depend on the design and the manufacturing facility.