SMT Assembly
Surface-mount technology places components onto solder-pasted pads before a controlled reflow process forms the joints. A good SMT release connects the footprint, stencil, placement data and inspection plan instead of treating each as a separate task.
Check placement data against the design
Your placement file should identify the reference designator, X/Y location, rotation and board side for each fitted component. Explain the origin and units. Rotation conventions can differ between CAD tools, so orientation needs to be checked against the assembly drawing.
Review the assembly process
Package mix, board thickness, thermal mass and component temperature limits influence the process. Ask the assembler to review stencil design, panel handling and reflow compatibility for the actual design. Avoid relying on a universal minimum spacing or temperature setting.
Match inspection to the joints
Optical inspection can find visible placement and solder issues; hidden joints require other methods. Define how BGA, QFN and other bottom-terminated devices will be assessed, and whether electrical or functional tests are included.
What to include in your RFQ
- Placement file with units, origin and rotation
- BOM with package and exact MPN
- Polarity and pin-one information
- Component and board handling requirements
- Inspection and test requirements
Confirm the process limits, material availability and acceptance criteria in your project quotation. They depend on the design and the manufacturing facility.