PCB Assembly, PCB Manufacturing,Printed Circuit Board Assembly

PCB Assembly

HDI phone board

 HDI circuit board is a high-density interconnection (High Density Interconnector) abbreviation, is the production of a printed circuit board (technology), the use of micro-blind buried hole technology, a relatively high density distribution circuit board. HDI circuit boards are designed for small capacity users of compact products. It is modular in parallel design, a module capacity of 1000VA (height 1U), natural cooling, can be directly into the 19 "rack, the largest parallel 6 modules. The product uses all-digital signal process control (DSP) technology and more Patented technology, with a full range of load capacity and strong short-term overload capacity, you can not consider the load power factor and peak factor.

HDI circuit board is a high-density interconnection (High Density Interconnector) abbreviation, is the production of a printed circuit board (technology), the use of micro-blind buried hole technology, a relatively high density distribution circuit board. HDI is designed for small capacity users of compact products. It is modular in parallel design, a module capacity of 1000VA (height 1U), natural cooling, can be directly into the 19 "rack, the largest parallel 6 modules. The product uses all-digital signal process control (DSP) technology and more Patented technology, with a full range of load capacity and strong short-term overload capacity, you can not consider the load power factor and peak factor.
Electronic design in the continuous improvement of machine performance at the same time, also efforts to reduce its size. From mobile phones to smart weapons, small portable products, "small" is always the same pursuit. High density integration (HDI) technology can make the end product design more compact, while meeting the higher standards of electronic performance and efficiency. HDI circuit board is currently widely used in mobile phones, digital camera (camera), MP3, MP4, notebook computers, automotive electronics and other digital products, including the most widely used mobile phone. HDI board generally used laminated (Build-up) manufacturing, the more the number of layers, the higher the technical level of the plate. Ordinary HDI circuit board is basically a laminated, high-grade HDI with 2 or more laminated technology, while the use of hole, plating hole, laser drilling and other advanced PCB technology. High-end HDI circuit board is mainly used in 3G mobile phones, advanced digital cameras, IC board and so on.
Development prospects: According to the use of high-end HDI circuit board - 3G board or IC carrier board, its future growth is very rapid: the next few years the world 3G mobile phone growth will exceed 30%, China will soon issue 3G licenses; IC board industry Advisors Prismark predicts that China's 2005-2010 forecast growth rate is 80%, which represents the direction of PCB technology development.

HDI circuit board advantages
   Can reduce the PCB circuit board cost: When the density of PCB increased more than eight layers, to HDI circuit board to manufacture, the cost will be more than the traditional complex pressure process is too low.
    Increase the line density: the traditional circuit board and the interconnection of parts
    Is conducive to the use of advanced construction technology
    Have better electrical performance and signal correctness
    Better reliability
    Can improve the thermal properties
    Can improve RF interference / electromagnetic interference / electrostatic discharge (RFI / EMI / ESD)
    Increase design efficiency
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