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Cryogenic Chip Radiating Insufficient? Try Ceramic Circuit Board!

 Although the air conditioning industry is facing a state of adjustment, but from the commercial buildings, public buildings and large villas on the central air conditioning and refrigerator industry demand is still in the growth period, the short term in the new commercial real estate area is still growing rapidly, supporting 15% of central air conditioning Growth pressure; at the same time, the refrigeration industry will be driven by energy efficiency policies and import substitution. It is expected that during the "12th Five-Year Plan" period, China's refrigeration and air-conditioning equipment industry will usher in a rapid development. Coupled with the further expansion of the cold chain market, for refrigeration, air conditioning equipment demand will be more and more, the refrigeration industry prospects are good.
However, the refrigeration industry to start a wide range of development, we must first find the bottleneck of the constraints, and the market of air-conditioning equipment and refrigeration industry's biggest bottleneck is the cooling surface heat dissipation conditions. As long as the cooling film in the case of no heat over two seconds will burn out, so heat is one of the main problems to solve.
Refrigeration chips are usually used to heat their use of special materials, the use of refrigeration in the market on the hot circuit board and the air conditioning and refrigeration industry did not bring much improvement in the cooling efficiency, then use the heat of the ceramic substrate To improve the quality of the product is an inevitable choice.
At present, the ceramic substrate on the market is divided into four kinds: thick-film ceramic substrate, low-temperature co-fired multi-layer ceramic, and thin-film ceramic substrate and LAM ceramic circuit board.
Thick film ceramic substrate
Thick-film ceramic substrate is used in the traditional screen printing technology production, and now Taiwan's production of thick-film ceramic substrate for the major manufacturers for Wo stretch hall, nine ho and other companies. In general, the use of screen printing to the process of making the line, usually because of network problems, easy to produce rough lines, the bit is not accurate phenomenon. As a result, the accuracy of the thick film ceramic substrate has been gradually used for future cooling sheets requiring increasingly small size requirements.
Low temperature co-fired multi-layer ceramic
Low temperature co-fired multi-layer ceramic technology to ceramic as a substrate material, the line using screen printing method printed on the substrate, and then integrated multi-layer ceramic substrate, and finally through the low temperature sintering, and its major manufacturers in Taiwan have Germany Electronics, € 370 Xin and other companies. The low temperature co-fired multi-layer ceramic substrate metal layer is also made by screen printing process, the same may be due to Zhang network problems caused by bit error, in addition, multi-layer ceramic laminated sintering, but also consider the shrinkage ratio of the problem The
Thin film ceramic substrate
In order to improve the problem of thick film process and the problem of shrinkage ratio after multi-layer sintering, a thin film ceramic substrate has recently been developed as a heat dissipation substrate. Thin film heat dissipation substrate is made by sputtering, electro / electrochemical deposition, and yellow lithography process. At present, Taiwan mainly to Ai Shi Bo electronic and with the Xin and other companies, with a professional film ceramic substrate production capacity.
LAM technology ceramic substrate
The advantages of the new LAM technology are not well known to the general population, but the ceramic circuit board produced by LAM technology does not have to consider the problem of the mesh in the process of thick film making and the shrinkage ratio after multi-layer sintering, nor the use of thin film ceramic substrate Sputtering, electrical / electrochemical deposition process caused by pollution, so LAM technology not only solve the thermal bottlenecks, but also the environmental protection work is also included in the long-term plan ahead. At present, only Wuhan public into three-dimensional electronic use of LAM technology to produce ceramic circuit boards.
Through the above four kinds of ceramic substrate comparison, it is clear that the use of LAM ceramic circuit board in the heat and environmental aspects of the refrigeration industry more in line with the diversified and comprehensive development.
At present, the cooling chip on the market needs a stable voltage and good heat dissipation, and LAM technology to produce ceramic circuit board thermal conductivity and substrate materials can meet the development requirements. Therefore, the use of LAM technology to produce ceramic circuit board will be to promote the cooling plate to continue to high power to enhance one of the important catalyst.
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